製品概要
概要
The MTP (modular telematics platform) provides an open development environment for prototyping smart driving applications, including vehicle connectivity to cloud services, to infrastructure and to other vehicles.
At the core of the MTP there is the ST Telmo and a set of module that integrates the ST’s Telemaco3P (STA1385) ASIL-B processor for an extended set of the NVM and DDR memories. The STA1385 device is automotive qualified for extended thermal range up to +150 °C junction temperature and includes a dedicated and isolated hardware security module to provide state-of-the-art on-chip security against automotive cyber-attacks.
The MTP also integrates ST’s automotive-grade multi-constellation GNSS Teseo IC with dead-reckoning sensors and offers expansion connector for optional plug-in TeseoAPP precise positioning module.
The platform enables the direct connection of automotive buses such as CAN, FlexRay, and BroadR-Reach® (100Base-T1), and features expansion connectors for several wireless connectivity options including BLE, Wi-Fi, LTE modules as well as V2X modules based on Autotalks Craton2 / Pluton2 products.
The MTP is delivered with a comprehensive starter package including everything required for the users to get started quickly, e.g. hardware design files, Linux BSP SW based on Yocto, sample application SW, optimized GNSS firmware and software tools (Teseo Suite, Flash Loader, UART port drivers).
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特徴
- Telemaco3P core processor module with 16x16 LFBGA (0.8 mm pitch) STA1385 Telemaco3P, 64 MB SQI NOR, 2 Gb NAND Flash, 2 8 GB EMMC, 512 MB DDR3L
- Crash detection accelerometers
- Teseo III multi-constellation GNSS system
- 6-axis accelerometer, odometer and rear gear engaged circuit for dead reckoning
- 2 Ethernet, compliant with IEEE-802.3-2002
- 1 user and reset push-buttons
- Backup battery circuit
- MEMS microphone and class-D audio out
- Board connectors:
- 2 Ethernet RJ45
- FlexRay and 100Base-T1 headers
- 3 DB-9 CAN/CAN-FD
- 2 mini-B USB
- mini-B USB-UART debug port
- SD™ card slot
- RCA amplified audio out
- SMA external GNSS antenna
- JTAG connector
- Board expansion connectors:
- LTE modem module
- Wi-Fi module
- V2X module
- Solder on ST33 e-SIM / HSM
- Alternative MEMS sensors module
- Precise positioning with dual-band Teseo-APP and L-Band Teseo –L modules
品質 & 信頼性
| 製品型番 | マーケティング･ステータス | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|
| MTP-TC3P-DVK | 量産中 | Ecopack1 | |
MTP-TC3P-DVK
Package:
Ecopack1Material Declaration**:
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
サンプル & 購入
| 製品型番 | 製品ステータス | Budgetary Price (US$)*/Qty | STから購入 | Order from distributors | パッケージ | 梱包タイプ | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | サプライヤ | Specific features | WEEE Compliant | コア製品 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTP-TC3P-DVK | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください |
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MTP-TC3P-DVK 量産中
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。