製品概要
主な利点
Advanced Processing Features
Leverage a complete toolbox of on-chip features, such as event-like mode, to save processing power and resources.
Ultra-Low Power
Extend battery life with low operating power and an auto-wake feature, enabling smart sensor activation in case of events.
Embedded Vision Ready
Integrate easily with any embedded platform, including entry-level MCUs, with MIPI CSI-2 or I3C image data output.
概要
The VD55G1 is a unique ultracompact and low-power image sensor in the ST BrightSense portfolio. It has been developed to enable the next generation of smart and power-efficient systems. Leveraging the world’s first 2.16 µm global shutter pixel, the sensor highlights maximum compactness. It has a tiny 2.73 x 2.16 mm² footprint that fits into the most size-constrained devices such as AR/VR glasses or personal electronics.
With its well-thought-out design, the VD55G1 maintains low power consumption even when pushed at the highest frame rates, making it ideal for battery-powered devices. In addition to this low operating power, the sensor embeds an auto wake-up feature. This enables the sensor to operate in an ultralow power sleepy mode when no change or event is detected. As soon as an event is detected, the sensor automatically sends a trigger to its host processor to switch into full streaming mode to capture the corresponding event. Thanks to this clever feature, vision system makers can finally get rid of the power-hungry, ineffective 24/7 operation of systems such as security cameras, auto-ID, or in-line product inspection.
Besides auto wake-up, the VD55G1 embeds a complete toolbox of on-chip features for optimizing image quality, adjusting frame rate, or improving data efficiency. Autoexposure, noise reduction, and various image corrections help to get stunning images directly from the sensor. This sensor can perform background removal for more efficient face ID, or capture event frames in an event-like mode, enabling the output of event information in a synchronous manner.
Combining a small form factor, power efficiency, and a full range of clever features, the VD55G1 is the ideal vision extension for the next generation of smart embedded systems. Its single-lane MIPI CSI-2 output and I²C or I3C control interface makes it natively compatible with the broadest range of processing units. To facilitate further integration, the sensor is provided along with development kits, camera modules, and drivers. All can be found on st.com.
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特徴
- Tiny sensor, which can fit everywhere:
- World’s first 2.16 µm global shutter pixel for optimum compactness
- Footprint of only 2.73 x 2.16 mm²
- Small optical format of 1/9 inch (800 x 700) and 1/10 inch (600 x 600)
- Ultralow power solution with:
- Smart auto wake-up feature, with ultralow power sleepy mode, and smart wake up when an event is detected
- Low power operation of ≤ 2 mW in auto wake-up mode
- Power consumption scaling with features, frame rate, and software standby
- Optimized image quality straight out of the sensor with:
- Cutting-edge performance of ST proprietary pixels combining global shutter, BSI, CDTI, and 3D stacking
- High sensitivity and sharpness in both visible and NIR
- Various on-chip features to optimize image quality, such as autoexposure, noise reduction, or defect correction
- Seamless integration into embedded systems:
- 1-lane MIPI CSI-2 output
- I²C and I3C control interface
- Effortless integration with VD55G1 development kit, camera modules, with drivers available from st.com
- Tiny sensor, which can fit everywhere:
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製品スペック (2)
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| 2.0 | 29 Apr 2024 | 29 Apr 2024 | ||
| 3.0 | 08 Aug 2024 | 08 Aug 2024 |
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| 2.0 | 18 Sep 2024 | 18 Sep 2024 |
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| 1.0 | 09 Dec 2024 | 09 Dec 2024 |
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| 1.0 | 10 Apr 2025 | 10 Apr 2025 |
EDAシンボル / フットプリント / 3Dモデル
STマイクロエレクトロニクス - VD55G1
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品質 & 信頼性
| 製品型番 | マーケティング･ステータス | パッケージ | グレード | RoHSコンプライアンスグレード | Longevity Commitment | Longevity Starting Date | 材料宣誓書** |
|---|---|---|---|---|---|---|---|
| VD55G1CCB0/RW | 量産中 | DIE | インダストリアル | N/A | 10 | 2024-01-01T00:00:00.000+01:00 |
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
サンプル & 購入
| 製品型番 | 製品ステータス | Budgetary Price (US$)*/Qty | STから購入 | Order from distributors | パッケージ | 梱包タイプ | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小 | 最大 | |||||||||||||
| VD55G1CCB0/RW | 量産中 | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください | DIE | Tape Mounted | FRANCE | EAR99 | NEC | -30 | 85 | ||||
VD55G1CCB0/RW 量産中
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。