The QSMP is a QFN Style Solder-Down Computer On Module, based on the STM32MP135 processor.
The module with a small square size of 27mm and a height of 2.3mm is single-sided assembled.
Its QFN type lead style has a 1mm pitch with 100 pads.
The module allows fully automated assembly in production. The special design of the pin contacts allows visual inspection after production.
There are 2 different versions of the module, with a choice of either 128MB SLC NAND or 4GB eMMC flash memory.
The NAND version is specified for a temperature range of -40 to +85°C.
Both versions come with 256MB DDR3 memory.
These modules are intended as very cost-effective computer cores for high-volume applications.
対応製品 | STM32MP1 |
Device Type | 統合型モジュール |
ファンクション | SOM |
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