製品概要
概要
The ST4SIM-300M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed for all IoT devices.
It is compliant with the GSM Association (GSMA) specification SGP.32 v1.2.
The ST4SIM-300M can remotely manage profiles of different MNOs while ensuring the appropriate security level to all eUICC stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).
The device can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element).
The device provides a secure and interoperable Java® Card environment compliant with Java® Card v. 3.0.5 Classic. Moreover, the device integrates the most advanced UICC features compliant with GlobalPlatform®, ETSI, 3GPP, 3GPP2 specifications.
The ST4SIM-300M integrates a dynamic memory management with Java® Card garbage collection mechanism optimizing the usage of the memory.
The ST4SIM-300M is based on the ST33K1M5M, an industrial grade hardware solution (JEDEC) supporting severe conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL6+, with a powerful 32-bit Arm® Cortex®-M35P CPU.
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特徴
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- Remote SIM provisioning compliant with GSMA eSIM for IoT and TCA specifications
- Bootstrap connectivity profile provided by a trusted partner
- Compliant with 4G (LTE) / CDMA / NB-IOT / CAT–M networks
- Network access applications supported: SIM / USIM / ISIM / CSIM
- Secure element access control (ARF / PKCS#15)
- OTA capability over SMS, CAT-TP and HTTPS (including DNS)
- Multi-Interfaces able to combine eSIM + eSE
- Hardware
- Product available on ST33K1M5M
- ST33 product based on a 32-bit Arm® Cortex®-M35P CPU core
- Supply voltage: Supply voltage ranges: 1.8 V, 3 V
- Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
- Serial peripheral interface (SPI) or I2C, depending on packages
- Industrial qualification (JEDEC JESD47)
- Operating temperature: -40°C to +105°C
- Common Criteria EAL6+
- ECOPACK-compliant packages
- Card plugin 2FF, 3FF, or 4FF
- VFDFPN8 5 × 6 mm, wettable flank (MFF2)
- WLCSP24
- セキュリティ
- Symmetric cryptography DES / 3DES / AES
- Asymmetric cryptography RSA (up to 2048 bits)
- HTTPS remote management TLS v1.0, v1.1 and v1.2
- Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpoolP256r1
- Authentication algorithm: MILENAGE, TUAK, CAVE and XOR
- Software standard compliancy
- GSMA SGP.32 v1.2
- TCA interoperable profile v3.3.1
- Java® Card v3.0.5 Classic
- GlobalPlatform® card specification v2.3, including amendments B, C, D, F, and H
- GlobalPlatform® enhancement with SCP11, ELF upgrade
- OS update mechanism
- ETSI, 3GPP and 3GPP2 release 17 (API Rel16)
- Power saving features (PSM & eDRX) defined by ETSI release 17
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STMicroelectronics - ST4SIM-300M
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品質 & 信頼性
| 製品型番 | マーケティング･ステータス | パッケージ | グレード | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|---|---|
| ST4SIM300M | 評価中 | DICE | インダストリアル | N/A | |
ST4SIM300M
Package:
DICEMaterial Declaration**:
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
サンプル & 購入
| 製品型番 | 製品ステータス | Budgetary Price (US$)*/Qty | STから購入 | Order from distributors | パッケージ | 梱包タイプ | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | Service and Connectivity Provider | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ST4SIM300M | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください |
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ST4SIM300M 評価中
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。