TSV521A

量産中
Design Win Education
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High merit factor (1.15 MHz for 45 uA) CMOS op-amps

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製品概要

概要

The TSV52x and TSV52xA series of operational amplifiers offer low voltage operation and rail-to rail input and output. The TSV521 device is the single version, the TSV522 device the dual version, and the TSV524 device the quad version, with pinouts compatible with industry standards.

The TSV52x and TSV52xA series offer an outstanding speed/power consumption ratio, 1.15 MHz gain bandwidth product while consuming only 45 μA at 5 V. The devices are housed in the smallest industrial packages.

These features make the TSV52x, TSV52xA family ideal for sensor interfaces, battery supplied and portable applications. The wide temperature range and high ESD tolerance facilitate their use in harsh automotive applications.

  • 特徴

    • Gain bandwidth product: 1.15 MHz typ. at 5 V
    • Low power consumption: 45 μA typ. at 5 V
    • Rail-to-rail input and output
    • Low input bias current: 1 pA typ.
    • Supply voltage: 2.7 to 5.5 V
    • Low offset voltage: 800 μV max.
    • Unity gain stable on 100 pF capacitor
    • AEC-Q100 qualified
    • Benefits:
      • Increased lifetime in battery powered applications
      • Easy interfacing with high impedance sensors
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eDesignSuite

eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.

Power Management Design Center

Thermal-electrical Simulators for Components

Signal Conditioning Design Tool

NFC/RFID Calculators

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Power Management Design Center

Power Supply Design Tool

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• PFC design with analog and digitial control
• Supports various PCB configurations
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太陽光発電システム
Power Management Design Center

LED Lighting Design Tool

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• Displays interactive and annotated schematic
• Provides current/voltage graphs, Bode plots, efficiency curves and power-loss data
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Power Management Design Center

Digital Power Workbench

• Provides a step-by-step optimized design of power section and control loop
• Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs
Power Management Design Center

Power Tree Designer

• Specify input/output power for each node in the tree
• Check for consistency
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Thermal-electrical Simulators for Components

AC Switches Simulator

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Thermal-electrical Simulators for Components

Rectifier Diodes Simulator

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• Estimate power losses
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Thermal-electrical Simulators for Components

STPOWER Studio

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• Provides power loss and temperature graphs
• Helps define heatsink thermal properties
Thermal-electrical Simulators for Components

Twister Sim

• Help select the right ViPOWER Automotive power device
• Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis
• Supports various PCB configurations
Thermal-electrical Simulators for Components

TVS Simulator

• Specify system ratings and surge waveform
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Thermal-electrical Simulators for Components

Estimate

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• Quickly generate reliable estimates of battery life, system power consumption and bill of materials costs
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Signal Conditioning Design Tool

Active Filters

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Signal Conditioning Design Tool

Comparators

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Signal Conditioning Design Tool

Low side Current Sensing

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Signal Conditioning Design Tool

High side Current Sensing

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NFC/RFID Calculators

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• Get antenna impedance
NFC/RFID Calculators

UHF Link Budget

• Enter forward and reverse link characteristics
• The tool returns link budget estimate
NFC/RFID Calculators

NFC Tuning Circuit

• Enter antenna parameter and matching target
• Select the topology of the matching network
• The tool returns component values for the desired design targets

推奨製品

EDAシンボル / フットプリント / 3Dモデル

STMicroelectronics - TSV521A

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Please select one model supplier :

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Symbols

EDAシンボル

Footprints

フットプリント

3D model

3Dモデル

すべてのリソース

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タイトル
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更新日

SPICE models (1)

タイトル
バージョン
更新日
TSV52x Pspice model
1.0 01 Aug 2015
01 Aug 2015
TSV52x Pspice model 1.0

品質 & 信頼性

製品型番 マーケティング･ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
TSV521AICT
量産中
SC70-5 インダストリアル Ecopack2 (**)

TSV521AICT

Package:

SC70-5

Material Declaration**:

PDF XML
More Info

Marketing Status

量産中

Package

SC70-5

Grade

Industrial

RoHS Compliance Grade

Ecopack2 (**)

(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

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