CAM-55G1

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CAM-55G1プロモジュール：VD55G1イメージセンサー用評価カメラモジュール

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概要

製品概要

主な利点

主な利点

プラグアンドプレイのカメラモジュール

すぐに始められるオールインワンモジュール - イメージセンサー、レンズホルダー、レンズ、コネクタ - 統合の準備が整っています。

多用途なレンズオプション

一貫したコネクタとピン配置を備えた多様な評価用カメラモジュールから、あなたに最適なレンズを選択してください。

生産へのシームレスな移行

STパートナーの生産ユニットからそのまま購入するか、レンズのカスタマイズを選択して、テストから生産へとスムーズに拡大できます。

概要

The CAM-55G1 promodules are a full range of sample camera modules made for a seamless evaluation and integration of the VD55G1 0.56-megapixel monochrome image sensor. These ready-to-use vision extensions integrate VD55G1 image sensor, lens holder, lens, and plug-and-play flex connection in a tiny format down to 6.5 mm square.

The CAM-55G1 line leverages the complete toolbox of on-chip features of the VD55G1 image sensor embedded, such as autoexposure, auto-wake up, background removal, or event-like mode. Multiple GPIOs enable users to synchronize the modules with triggers and illumination. Featuring a single lane MIPI CSI-2 output and very low operating power, the promodules are perfectly suited for embedded low-power setups.

Multiple promodule references are available, featuring various lenses to best match the needs of every application in terms of optical setup and mechanical constraints. All camera modules are equipped with the same FPC-to-board connector and pinout. This plug-and-play architecture allows users to change promodule instantly, and reuse the same setup with different lenses, color options and even different image sensors in the ST BrightSense portfolio.

CAM-55G1 promodules can be tested and integrated on computers or embedded processing boards using hardware and software tools from STMicroelectronics. The compatible EVK Main and P-Board hardware kits enable straight connection to PC and embedded processing platforms respectively. Evaluation GUI software and Linux drivers are available for download from the Imaging Software section of the website.

  • 特徴

    • “Promodules”: turnkey camera modules for evaluation:
      • Including VD55G1 image sensor, lens holder, lens, and plug-and-play flex connection.
      • Lens focused, glued, and tested in cleanroom environment using specialized equipment.
      • Small footprint down to 6.5 mm square, with smaller dimension achievable as a customized solution from partner camera module integrators.
    • High lens flexibility:
      • Ultra-wide-angle lens for wide scene capture (160° DFOV).
    • Plug-and-play connector to change promodules at any time:
      • FPC-to-board 30-pin connector.
      • Same connector for all ST promodules.
    • Ready for evaluation and integration:
      • On computer with a USB output using the EVK Main hardware tool and the Evaluation GUI free software.
      • On embedded processing platforms with a MIPI CSI-2 output using the P-Board hardware tool and free Linux software tools.

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The current status of a product:
Active: Product is in volume production
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Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Budgetary PriceMain country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.