STDES-SICGP4

量産中

Testing platform of SiC MOSFETs in HiP247-4 package

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製品概要

概要

The STDES-SICGP4 reference design allows evaluating the switching and thermal performance of power SiC MOSFETs in an HiP247-4 (four-lead) package in a half-bridge topology.

The MOSFETs are controlled by isolated gate drivers. Drivers are supplied by isolated DC-DC converters.

The system requires the connection of an external inductor, a source, a load, an auxiliary supply, and PWM signals. It can be used to test operation in buck or boost configuration.

It is possible to use a low inductance shunt or to assemble a coaxial shunt to measure current through the low side MOSFET. In this perspective, the board can be used as a tool for double pulse test (DPT), to measure overshoot (voltage and current), speed (di/dt; dv/dt), and switching energy (EON; EOFF; ERR).

  • 特徴

    • Half-bridge structure assembled with power SiC MOSFETs in an HiP247-4 package
    • Half-bridge driven by the STGAP2HS galvanic isolated gate driver optimized for SiC MOSFETs
    • Isolated gate drivers supplied by an isolated fly-buck converter based on the L6986I
    • Preset +18 V/-3 V supply voltage for output stage of isolated gate drivers
    • Possibility to set a specific gate voltage, positive and negative level
    • Possibility to set the gate resistor
    • Low inductance sense resistor
    • Prepared for a coaxial shunt resistor for a higher bandwidth of current measurement
    • Specifications:Max. DC input/output voltage: 1 kVInput current level peak (duration up to 100 μs): 69 A

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The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
Marketing description of the package type.Compliancy of the device with industry requirement domains (IRD)The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.
Compliancy with WEEE Directive (2012/19/EU)The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
Budgetary PriceMain country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.