ST4SIM-200M

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GSMA eSIM system-on-chip for secure M2M industrial applications

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概要

製品概要

概要

概要

The ST4SIM-200M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed for all industrial devices.

It is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2.

The device can manage different MNO profiles while ensuring the appropriate security level to all eSIM stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).

The device can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element).

The device provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. Moreover, the device integrates the most advanced UICC features compliant with GlobalPlatform, ETSI, 3GPP, 3GPP2 specifications.

The device integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory.

The device is based on the ST33G1M2M, an industrial grade hardware solution (JEDEC) supporting severe conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm SecurCore SC300 RISC core.

  • 特徴

      • Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications
      • Bootstrap connectivity profile provided by a trusted partner
      • Up to 7 connectivity profiles (depending on memory size)
      • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
      • Network access applications supported: SIM / USIM / ISIM / CSIM
      • Secure element access control (ARF / PKCS#15)
      • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
      • Multi-interfaces able to combine eSIM + eSE
    • Hardware
      • Product available on ST33G1M2M
      • ST33 product based on a 32-bit Arm® SecurCore® SC300™ RISC core
      • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
      • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
      • Serial peripheral interface (SPI), depending on packages
      • Industrial qualification (JEDEC JESD47)
      • Operating temperature: -40°C to +105°C
      • Common Criteria EAL5+
    • ECOPACK-compliant packages
      • 2FF, 3FF or 4FF plugin card (based on D16 micromodule)
      • VFDFPN8 5 × 6 mm, wettable flank (MFF2)
      • WLCSP11
    • セキュリティ
      • Symmetric cryptography DES / 3DES / AES
      • Asymmetric cryptography RSA (up to 2048 bits)
      • HTTPS remote management TLS v1.0, v1.1 and v1.2
      • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
      • Authentication algorithm: MILENAGE, TUAK, CAVE
    • Software standard compliance
      • GSMA SGP.02 v3.2
      • SIMalliance interoperable profile v2.1
      • Java® Card v3.0.4 Classic
      • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
      • ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office)
      • Power saving features (PSM and eDRX) defined by ETSI release 13
    • Certification
      • GlobalPlatform®-certified "Muse eUICC-i2 v1" compliant with GSMA SGP.02 v3.2

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The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Marketing description of the package type.Compliancy of the device with industry requirement domains (IRD)The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Budgetary PriceMarketing description of the package type.Storage method used to contain product.Main country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.