製品概要
概要
X-LINUX-MSP1 is an STM32 MPU OpenSTLinux expansion package targeting an X-STM32MP-MSP01 evaluation board mounted on STM32MP157F-DK2 or STM32MP135F-DK discovery board.
The software package provides a sensor fusion application using IMUs, Time-of-Flight (ToF), and ambient light sensor (ALS) with a web-client based 3D demo.
Python APIs are provided to access the onboard sensors for application development.
The X-LINUX-MSP1 OpenSTLinux expansion package v1.0.x is compatible with the Yocto project build system Kirkstone.
It is validated over the OpenSTLinux distribution v5.0 on STM32MP157F-DK2 and STM32MP135F-DK boards.
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特徴
- Expansion software for building applications for the STM32MP1 series microprocessors, using the X-STM32MP-MSP01 expansion board
- Python APIs that provide easy access to the following sensors:
- Motion sensors: ISM330DHCX, IIS2DLPC, IIS2MDC
- Pressure sensor: LPS22HH
- Time-of-Flight sensor (VL53L5CX) and ambient light sensor (VD6283TX)
- Sensor visualization app to stream real-time sensor data and sensor fusion output to a web client over a network connection
- Sample GTK-based application to display the sensor data on the MPU board LCD
- Sample data logging application to log the sensor data for later processing
- Compiled binaries are included to enable quick evaluation of the solution using the OpenSTLinux starter package
- Sources of various applications and driver patches are provided to enable customization using the OpenSTLinux developer package
- Free, user-friendly license terms
ソフトウェア入手
| 製品型番 | 概要 | 最新バージョン | サプライヤ | ECCN (EU) | ECCN (US) | ダウンロード |
|---|---|---|---|---|---|---|
| X-LINUX-MSP1 | STM32 MPU OpenSTLinux software package for X-STM32MP1-MSP01 expansion board | 1.0.0 | ST | NEC | 3D991 | x ライセンス契約 BY INSTALLING COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF (AND THE RELATED DOCUMENTATION) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (STMICROELECTRONICS), THE RECIPIENT, ON BEHALF OF HIMSELF OR HERSELF, OR ON BEHALF OF ANY ENTITY BY WHICH SUCH RECIPIENT IS EMPLOYED AND/OR ENGAGED AGREES TO BE BOUND BY THIS SOFTWARE PACKAGE LICENSE AGREEMENT. Under STMicroelectronics’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in this software package and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the software package or any part thereof, with or without modification, are permitted provided that the following conditions are met:
THIS SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY. |
