X-STM32MP-MSP01

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STM32MP expansion board for motion MEMS, environmental, ToF, and ALS sensor applications

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概要

製品概要

概要

概要

The X-STM32MP-MSP01 is a multisensor evaluation board that embeds motion MEMS, environmental, ambient light and Time-of-Flight sensors, a digital microphone, and an NFC tag. This board works with the STM32MPU discovery kit. It can be used with the X-LINUX-MSP1 to read the sensors.

The X-STM32MP-MSP01 main devices are the ISM330DHCX 3-axis accelerometer and gyroscope, the IIS2MDC 3-axis magnetometer, and the LPS22HH MEMS nano pressure sensor.

The board also includes the STTS22H digital temperature sensor, the VD6283TX ambient light sensor, the IIS2DLPC 3-axis accelerometer, the VL53L5CX multizone ranging sensor, and the MP23DB02MM digital MEMS microphone. The on-board dynamic NFC/RFID tag IC can work with a dual interface for the I²C, through a 13.56 MHz RFID reader, or via an NFC phone.

The X-STM32MP-MSP01 interfaces with the STM32MP1Dev via a 40-pin GPIO connector pins using I²C, SPI, and general GPIO pins. It is compatible with STM32MP157F-DK2 and a Raspberry Pi GPIO connector layout.

  • 特徴

    • Included sensors:ISM330DHCX: 3-axis accelerometer and 3-axis gyroscopeIIS2MDC: 3-axis digital magnetometer (±50 gausses)IIS2DLPC: 3-axis accelerometer for industrial applications (±2/±4/±8/±16 g)STTS22H: digital temperature sensor (-40 to +125°C)LPS22HH: nano pressure sensor (260 - 1260 hPa)VD6283TX: ambient light sensorVL53L5CX: Time-of-Flight (ToF) multizone ranging sensor
    • Dynamic NFC/RFID tag
    • Digital microphone
    • Standard DIL 24 pin socket for adapter boards
    • Compatible with STM32MP157F-DK2 and Raspberry Pi

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The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Marketing description of the package type.Compliancy of the device with industry requirement domains (IRD)The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.Compliancy with WEEE Directive (2012/19/EU)The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Budgetary PriceMain country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.