A1P35S12M3-F

量産中
Design Win
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ACEPACK1 sixpack topology, 1200 V, 35 A trench-gate field stop IGBT M series, soft diode and NTC

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製品概要

概要

This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz.

  • 特徴

    • ACEPACK™ 1 power module
      • DBC Cu Al2O3 Cu
    • Sixpack topology
      • 1200 V, 35 A IGBTs and diodes
      • Soft and fast recovery diode
    • Integrated NTC
    続きを読む 一部を表示

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太陽光発電システム
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STMicroelectronics - A1P35S12M3-F

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品質 & 信頼性

製品型番 マーケティング･ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
A1P35S12M3-F
量産中
ACEPACK 1 インダストリアル Ecopack1

A1P35S12M3-F

Package:

ACEPACK 1

Material Declaration**:

PDF XML
More Info

Marketing Status

量産中

Package

ACEPACK 1

Grade

Industrial

RoHS Compliance Grade

Ecopack1

(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。

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