製品概要
概要
The ACEPACK SMIT is a very compact surface mounted SiC MOSFET module. Thanks to the DBC substrate, the ACEPACK SMIT package provides reliable insulation, a low thermal resistance and high flexibility, enabling several configurations.
The SiC MOSFETs inside provide outstanding features, like very low on-resistance, fast switching, reduced parasitic, and robust body diode. The half-bridge association can be used to build several topologies: totem pole PFC, full, and B6 bridges.
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特徴
- AQG 324 qualified
- Half-bridge topology SiC MOSFET module
- 1200 V rated voltage
- Dice on direct bond copper (DBC) substrate
- SMD with insulated top side cooling
- Isolation voltage of 3.4 kVrms
- Low thermal resistance
- Package molding compound group I (CTI ≥ 600 V, 1000 Vrms in pollution degree 2)
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