产品概述
描述
The USBLC6-2SC6Y is a monolithic device dedicated to ESD protection of high speed interfaces, such as USB 2.0, Ethernet links and video lines.
The very low line capacitance secures a high level of signal integrity without compromising in protecting sensitive chips against the most stringent characterized ESD strikes.
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所有功能
- Very low leakage current: 10 nA
- RoHS compliant
- AEC-Q101 qualified
- Benefits
- Very low capacitance between lines to GND for optimized data integrity and speed
- Low PCB space consumption
- Enhanced ESD protection. ISO10605 up to 25 kV guaranteed at device level
- ESD protection of VBUS
- High reliability offered by monolithic integration
- Fast response time
- Consistent D+ / D- signal balance:
- Very low capacitance matching toleranceI/O to GND = 0.015 pF
- Compliant with USB 2.0 requirements
- Complies with the following standards
- ISO10605: C = 150 pF, R = 330 Ω
- 25 kV (air discharge)
- 15 kV (contact discharge)
- ISO10605: C = 330 pF, R = 330 Ω
- 15 kV (air discharge)
- 15 kV (contact discharge)
- ISO7637-3
- Pulse 3a: Vs = -150 V
- Pulse 3b: Vs = +100 V
- USB 2.0 ports up to 480 Mb/s (high speed)
- Compatible with USB 1.1 low and full speed
- High-speed datalines in smart junction boxes
- Ethernet port: 10/100 Mb/s
- Video line protection
- ISO10605: C = 150 pF, R = 330 Ω
特别推荐
所有资源
资源标题 | 版本 | 更新时间 |
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产品规格 (1)
资源标题 | 版本 | 更新时间 | ||
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2.0 | 19 Sep 2016 | 19 Sep 2016 |
应用手册 (5 of 10)
资源标题 | 版本 | 更新时间 | ||
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1.1 | 16 Jan 2024 | 16 Jan 2024 | ||
1.0 | 29 Apr 2024 | 29 Apr 2024 | ||
2.0 | 20 Nov 2024 | 20 Nov 2024 | ||
2.0 | 09 Jan 2023 | 09 Jan 2023 | ||
7.0 | 27 Jun 2023 | 27 Jun 2023 | ||
3.1 | 30 May 2024 | 30 May 2024 | ||
3.2 | 18 Feb 2022 | 18 Feb 2022 | ||
2.1 | 04 Oct 2021 | 04 Oct 2021 | ||
6.0 | 31 Oct 2024 | 31 Oct 2024 | ||
3.0 | 23 Feb 2023 | 23 Feb 2023 |
技术文档 (2)
资源标题 | 版本 | 更新时间 | ||
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1.3 | 23 Feb 2022 | 23 Feb 2022 | ||
3.0 | 01 Mar 2022 | 01 Mar 2022 |
简报 (3)
资源标题 | 版本 | 更新时间 | ||
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1.2 | 15 Sep 2022 | 15 Sep 2022 | ||
1.0 | 28 Jan 2021 | 28 Jan 2021 | ||
1.0 | 02 Feb 2024 | 02 Feb 2024 |
宣传册 (5 of 9)
资源标题 | 版本 | 更新时间 | ||
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1.0 | 27 May 2021 | 27 May 2021 | ||
1.0 | 01 Aug 2015 | 01 Aug 2015 | ||
1.0 | 05 Jun 2023 | 05 Jun 2023 | ||
1.0 | 29 Apr 2022 | 29 Apr 2022 | ||
1.0 | 02 Dec 2024 | 02 Dec 2024 | ||
1.0 | 05 Apr 2022 | 05 Apr 2022 | ||
1.0 | 03 Mar 2025 | 03 Mar 2025 | ||
1.0 | 13 Mar 2025 | 13 Mar 2025 | ||
1.0 | 15 Jul 2024 | 15 Jul 2024 |
手册 (3)
资源标题 | 版本 | 更新时间 | ||
---|---|---|---|---|
1.0 | 29 Jun 2020 | 29 Jun 2020 | ||
1.0 | 28 Mar 2023 | 28 Mar 2023 | ||
03.25 | 30 Jul 2024 | 30 Jul 2024 |
EDA符号、封装和3D模型
意法半导体 - USBLC6-2SC6Y
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :

符号

封装

3D模型
所有资源
资源标题 | 版本 | 更新时间 |
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SPICE models (1)
资源标题 | 版本 | 更新时间 | ||
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ZIP | 1.0 | 15 Nov 2019 | 15 Nov 2019 |
CAD Symbol & Footprint models (2)
资源标题 | 版本 | 更新时间 | ||
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ZIP | 1.0 | 20 May 2020 | 20 May 2020 | |
ZIP | 1.0 | 26 Mar 2020 | 26 Mar 2020 |
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质量与可靠性
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
样片和购买
产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | Breakdown Voltage (V) (min) | |||||||||||
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最小值 | 最大值 | |||||||||||||||||||||||
USBLC6-2SC6Y | | | Available at distributors 经销商的可用性 USBLC6-2SC6Y
代理商库存报告日期: | | | | Buy from Distributor | |
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USBLC6-2SC6Y 批量生产
产品型号:
USBLC6-2SC6Y
Operating Temperature (°C)
Min:
Max:
Breakdown Voltage (V) (min):
6
代理商库存报告日期:
库存
Min.Order