ST33KTPM2I

批量生产

面向工业设备的TPM 2.0器件

下载数据摘要

产品概述

描述

STSAFE-TPM(可信平台模块)系列产品为嵌入式、PC、移动和计算应用提供了丰富的标准化解决方案。STSAFE是意法半导体的商标。

该系列包含符合可信计算组织 (TCG) 标准的一站式产品,能够提供保护信息和设备机密性、完整性及真实性的服务。

得益于多样化的接口支持和TPM生态系统软件解决方案的可用性,这些器件具备出色的易集成性。

STSAFE-TPM器件通过了所有通用标准 (EAL4+) 和FIPS认证。

ST33KTPM2I默认提供两种专用配置:

- 从器件串行外设接口 (SPI)

- 目标I²C接口。

这两种配置均符合TCG PC客户端TPM配置文件规范。

它在TPM固件升级过程中提供弹性服务,并能在检测到故障时自动恢复TPM固件与关键数据。

ST33KTPM2I支持-40 °C至105 °C的宽工作温度范围。

ST33KTPM2I器件采用Ecopack2封装。

ST33KTPM2I器件适用于工业和消费类应用,采用TCG标准UFQFPN32可湿性侧面和WLCSP24封装。

  • 所有功能

    • TPM功能
      • 基于Flash存储器的可信平台模块 (TPM)
      • 符合可信计算组织 (TCG) 可信平台模块 (TPM) 库规范2.0、第1.59版修订版勘误1.4,以及TPM 2.0版本1.05的TCG PC客户端平台TPM配置文件 (PTP) 要求
      • 容错固件加载器可在加载过程中断时(自动恢复)维持TPM的全部功能
      • 符合SP800-193的保护、检测和恢复要求
      • 目标通过的认证:
        • 符合通用标准EAL4+认证,满足TPM 2.0保护配置文件要求(通过AVA_VAN.5增强,具备抵御高潜力攻击的能力)
        • FIPS 140-3
        • 通过TCG认证
      • SPI支持高达48 MHz
      • I²C支持高达1 MHz
    • 硬件特性
      • 带纠错码的高可靠性Flash存储器
      • 更宽的温度范围:-40 °C至105 °C
      • 静电放电 (ESD) 保护,高达4 kV (HBM)
      • 1.8 V或3.3 V供电电压范围
    • 安全加密特性
      • 主动屏蔽
      • 监控环境参数
      • 硬件和软件保护,防止故障注入和侧信道攻击
      • 符合FIPS SP800-90A和AIS20的确定性随机位生成器 (DRBG)
      • 符合FIPS SP800-90B和AIS31的真随机数生成器 (TRNG)
      • 密码算法:
        • RSA密钥生成(1024、2048、3072和4096位)
        • RSA签名(RSASSA-PSS、RSASSA-PKCS1v1_5)
        • RSA加密(RSAES-OAEP、RSAESPKCS1-v1_5)
        • SHA-1、SHA-2(256和384位)、SHA-3(256和384位)
        • HMAC SHA-1、SHA-2和SHA-3
        • AES-128、192和256位
        • ECC(NIST P-256、P-384曲线):支持密钥生成、ECDH、ECDSA和ECSchnorr
        • ECDAA(BN-256曲线)
      • 器件具有3个签署密钥 (EK) 和EK证书(RSA2048、ECC NIST P-256和ECC NIST P-384)
      • 器件预配置3个2048位RSA密钥对,可缩短TPM配置时间
    • 产品目标合规性
      • 符合Microsoft® Windows® 10和11要求
      • 兼容Linux®驱动程序
      • 符合Intel® vPro®技术
      • 符合TPM 2.0的TCG测试套件
      • 兼容开源TCG TPM 2.0 TSS实现

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The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
Marketing description of the package type.The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.
The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
Budgetary PriceMarketing description of the package type.Storage method used to contain product.Main country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.