ST25RU3993

NRND
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RAIN RFID单芯片读卡器，可与EPC Class1 Gen2相兼容

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概述

产品概述

描述

描述

在840-960 MHz UHF频段，ST25RU3993 RAIN® (UHF) RFID读卡器设备提供多协议支持，并与ISO18000-62 & -63、ISO29143和GS1的EPC UHF Gen2空中接口协议兼容。它包括一个片上VCO和一个功率放大器，可提供一整套RFID功能，包括密集读写器模式（DRM）功能，并能支持跳频、低电平传输编码、低电平解码、数据成帧和CRC校验。

ST25RU3993可以极低功率运行，这使其适用于便携式和电池供电的设备，如手机。

ST25RU3993采用7x7 mm QFN封装，具有很高的灵敏度，并能抵抗天线反射和自干扰的影响。这对于移动应用和嵌入式应用非常重要，在这些应用中天线设计常受到成本或尺寸的限制。其高灵敏度使得终端产品在使用更简单更便宜的天线时，也能实现其所需的读取范围，从而可以降低整个系统成本。

由于其高度集成性，ST25RU3993仅需一个外部8位微控制器即可创建完整的RFID读写器系统，因此无需复杂的RFID协处理器。

  • 所有功能

    • 供电电压范围为3.0至3.6 V
      • 有限工作电压可低至2.7 V
      • 最大PA供电电压为4.3 V
      • 外设I/O电源范围为1.65至5.5 V
    • 协议支持：
      • ISO 18000-6C（EPC Class1 Gen2）
      • ISO 29143（移动RFID的空中接口）
      • 直接模式的ISO 18000-6A/B
    • DRM：用于M4和M8的250 kHz和320 kHz滤波器
    • 集成电源稳压器
    • 支持跳频
    • ASK或PR-ASK调制
    • 自动I/Q选择
    • 采用8位线性RSSI的标签跟踪相位位
    • 温度范围：-40 °C至85 °C
    • 48引脚QFN（7x7x0.9 mm）封装
    • 标签读取速度最快可达到700*标签/秒（16位标签EPC长度）

eDesignSuite

eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.

Power Management Design Center

Thermal-electrical Simulators for Components

Signal Conditioning Design Tool

NFC/RFID Calculators

Choose design tool:
Power Management Design Center

Power Supply Design Tool

• SMPS design, by topology, by type and by product
• PFC design with analog and digitial control
• Supports various PCB configurations
Choose type:
DC/DC
AC/DC
太阳能电池充电器
Power Management Design Center

LED Lighting Design Tool

• Handles AC-DC and DC-DC design in common topologies
• Displays interactive and annotated schematic
• Provides current/voltage graphs, Bode plots, efficiency curves and power-loss data
Choose type:
DC/DC
AC/DC
Power Management Design Center

Digital Power Workbench

• Provides a step-by-step optimized design of power section and control loop
• Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs
Power Management Design Center

Power Tree Designer

• Specify input/output power for each node in the tree
• Check for consistency
• Design each individual node
Choose design tool:
Thermal-electrical Simulators for Components

AC Switches Simulator

• Select ratings and application waveforms
• Get junction temperature and blocking voltage graphs
• Search and sort suitable devices
Thermal-electrical Simulators for Components

Rectifier Diodes Simulator

• Select ratings and application waveforms
• Estimate power losses
• Search and sort suitable devices
Thermal-electrical Simulators for Components

STPOWER Studio

• Supports long mission profiles
• Provides power loss and temperature graphs
• Helps define heatsink thermal properties
Thermal-electrical Simulators for Components

Twister Sim

• Help select the right ViPOWER Automotive power device
• Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis
• Supports various PCB configurations
Thermal-electrical Simulators for Components

TVS Simulator

• Specify system ratings and surge waveform
• Search and sort suitable devices
Thermal-electrical Simulators for Components

Estimate

• Build simple schematics and firmware inputs in minutes
• Quickly generate reliable estimates of battery life, system power consumption and bill of materials costs
Thermal-electrical Simulators for Components

PCB Thermal Simulator

• Thermal analysis of a PCB from Gerber files.
• Possibility to add heat sources, heat sinks, copper areas and thermal paths.
• Powerful server-side engine for rendering and simulation.
• Thermal results shown graphically via 2D table.
Choose design tool:
Signal Conditioning Design Tool

Active Filters

• Handles multi-stage-designs and common topologies
• Returns circuit component values
• Provides gain, phase and group delay graphs
• Low Pass, High Pass and Band Pass
Signal Conditioning Design Tool

Comparators

• Handles most common configurations
• Returns circuit components values
• Provides I/O signal waveforms
• Inverting, Non Inverting, Window
Signal Conditioning Design Tool

Low side Current Sensing

• Returns circuit component values
• Provides current error graphs
Signal Conditioning Design Tool

High side Current Sensing

• Provides current error graphs.
• Help to select the right High side current sensing and shunt devices.
Choose design tool:
NFC/RFID Calculators

NFC Inductance

• Input geometry and substrate properties
• Get antenna impedance
NFC/RFID Calculators

NFC Tuning Circuit

• Enter antenna parameter and matching target
• Select the topology of the matching network
• The tool returns component values for the desired design targets
NFC/RFID Calculators

UHF Link Budget

• Enter forward and reverse link characteristics
• The tool returns link budget estimate

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The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Marketing description of the package type.Compliancy of the device with industry requirement domains (IRD)The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.Longevity Commitment in yearsLongevity Starting DateThe current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Budgetary PriceMarketing description of the package type.Storage method used to contain product.Main country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.