ST25R3911B

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NFC / HF RFID读写器IC

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概述

产品概述

描述

描述

ST25R3911B是高度集成的NFC发起设备 / HF读写器IC，包括模拟前端（analog front end，AFE）和一个高度集成的数据成帧系统，可用于ISO 18092（NFCIP-1）发起设备、ISO 18092（NFCIP-1）主动目标设备、ISO 14443A和B读写器（包括高比特率）、ISO 15693读写器以及FeliCa™读写器。其他标准和自定义协议（如MIFARE™ Classic）可使用AFE实现，并可在外部微控制器（Stream和Transparent模式）中实现数据打包。

ST25R3911B完全适用于NFC系统的基础结构侧，在这些系统中用户需要最佳RF性能和灵活性以及低功耗能力。

由于采用了自动天线调谐（AAT）技术，该器件对于具有直接驱动天线的应用是最优的。ST25R3911B在HF读写器IC领域是独一无二的，因为它具有两个差分低阻抗（1 Ohm）天线驱动器。

ST25R3911B包含多种功能，使其非常适合于低功耗应用。它包含一个低功耗电容传感器，可用来检测卡片是否存在，而无需开启读写器场。也可通过对天线LC谐振腔上的信号进行幅度或相位测量，并将其与存储参考值进行比较，来检测卡片是否存在。它还包含了一个低功耗RC振荡器和唤醒定时器，可用来在定义时间周期后唤醒系统，以及使用一种或多种低功耗检测技术（电容，相位或幅度）来检查标签是否存在。

ST25R3911B经过设计，可在宽范的（2.4 V至5.5 V）电源供电范围内工作；外设接口IO引脚支持的电源供电范围为1.65 V至5.5 V。

  • 所有功能

    • ISO 18092（NFCIP-1）Active P2P
    • ISO14443A、ISO14443B、ISO15693和FeliCa™
    • 支持VHBR（3.4 Mbit/s PICC到PCD帧，6.8 Mbit/s AFE和PCD到PICC帧）
    • 电容式唤醒
    • 自动天线调谐系统，可支持天线LC谐振腔调谐
    • 自动调制指数调整
    • 可自动选择的AM和PM解调器通道
    • DPO（动态功率输出）
    • 差分输出可达1.4 W
    • 用户可选择和自动增益控制
    • 透传和流模式实现了兼容MIFARE™ Classic或其他自定义协议
    • 单端模式下，可驱动两个天线
    • 振荡器输入，使用13.56 MHz或27.12 MHz晶振，可快速启动
    • 6 Mbit/s SPI，具有96字节的FIFO
    • 宽泛的供电电压范围：2.4 V 至5.5 V
    • 宽泛的温度范围：-40 °C至125 °C
    • QFN32，5x5 mm封装或提供晶圆

eDesignSuite

eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.

Power Management Design Center

Thermal-electrical Simulators for Components

Signal Conditioning Design Tool

NFC/RFID Calculators

Choose design tool:
Power Management Design Center

Power Supply Design Tool

• SMPS design, by topology, by type and by product
• PFC design with analog and digitial control
• Supports various PCB configurations
Choose type:
DC/DC
AC/DC
太阳能电池充电器
Power Management Design Center

LED Lighting Design Tool

• Handles AC-DC and DC-DC design in common topologies
• Displays interactive and annotated schematic
• Provides current/voltage graphs, Bode plots, efficiency curves and power-loss data
Choose type:
DC/DC
AC/DC
Power Management Design Center

Digital Power Workbench

• Provides a step-by-step optimized design of power section and control loop
• Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs
Power Management Design Center

Power Tree Designer

• Specify input/output power for each node in the tree
• Check for consistency
• Design each individual node
Choose design tool:
Thermal-electrical Simulators for Components

AC Switches Simulator

• Select ratings and application waveforms
• Get junction temperature and blocking voltage graphs
• Search and sort suitable devices
Thermal-electrical Simulators for Components

Rectifier Diodes Simulator

• Select ratings and application waveforms
• Estimate power losses
• Search and sort suitable devices
Thermal-electrical Simulators for Components

STPOWER Studio

• Supports long mission profiles
• Provides power loss and temperature graphs
• Helps define heatsink thermal properties
Thermal-electrical Simulators for Components

Twister Sim

• Help select the right ViPOWER Automotive power device
• Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis
• Supports various PCB configurations
Thermal-electrical Simulators for Components

TVS Simulator

• Specify system ratings and surge waveform
• Search and sort suitable devices
Thermal-electrical Simulators for Components

Estimate

• Build simple schematics and firmware inputs in minutes
• Quickly generate reliable estimates of battery life, system power consumption and bill of materials costs
Thermal-electrical Simulators for Components

PCB Thermal Simulator

• Thermal analysis of a PCB from Gerber files.
• Possibility to add heat sources, heat sinks, copper areas and thermal paths.
• Powerful server-side engine for rendering and simulation.
• Thermal results shown graphically via 2D table.
Choose design tool:
Signal Conditioning Design Tool

Active Filters

• Handles multi-stage-designs and common topologies
• Returns circuit component values
• Provides gain, phase and group delay graphs
• Low Pass, High Pass and Band Pass
Signal Conditioning Design Tool

Comparators

• Handles most common configurations
• Returns circuit components values
• Provides I/O signal waveforms
• Inverting, Non Inverting, Window
Signal Conditioning Design Tool

Low side Current Sensing

• Returns circuit component values
• Provides current error graphs
Signal Conditioning Design Tool

High side Current Sensing

• Provides current error graphs.
• Help to select the right High side current sensing and shunt devices.
Choose design tool:
NFC/RFID Calculators

NFC Inductance

• Input geometry and substrate properties
• Get antenna impedance
NFC/RFID Calculators

UHF Link Budget

• Enter forward and reverse link characteristics
• The tool returns link budget estimate
NFC/RFID Calculators

NFC Tuning Circuit

• Enter antenna parameter and matching target
• Select the topology of the matching network
• The tool returns component values for the desired design targets

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The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Marketing description of the package type.Compliancy of the device with industry requirement domains (IRD)The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.Longevity Commitment in yearsLongevity Starting DateThe current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Budgetary PriceMarketing description of the package type.Storage method used to contain product.Main country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.