STM32MP255C

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MPU with Dual Arm Cortex-A35 @1.2GHz, Cortex-M33 @400MHz, 2xEthernet, 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI/NN, Secure Boot, Cryptography, DRAM enc/dec, PKA

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Product overview

Key Benefits

Rich interfaces

2x Ethernet ports with TSN support, FD-CAN, PCIe/USB3.0 and more. Parallel and MIPI CSI-2 for camera. Parallel, LVDS and MIPI DSI for display.

Enhanced security

Advanced security features with SESIP3 target certification supporting security functions for IoT and industrial applications.

Processing and edge AI capabilities

Dual Cortex-A35, Cortex-M33, neural processing unit (NPU) with 1.35 TOPS and graphics processing unit (GPU).

Description

STM32MP25xC/F devices are based on the high-performance single or dual-core Arm® Cortex®-A35 64-bit RISC core operating at up to 1.5 GHz. The Cortex®‑A35 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU, and a 512-Kbyte L2 cache. The Cortex®‑A35 processor uses a highly efficient 8-stage in-order pipeline that has been extensively optimized to provide full Armv8-A features while maximizing area and power efficiency.

STM32MP25xC/F devices also embed a Cortex®-M33 32-bit RISC core operating at up to 400 MHz frequency. The Cortex®-M33 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions, and data types. The Cortex®-M33 supports a full set of DSP instructions, TrustZone®, and a memory protection unit (MPU) which enhances application security.

The devices also embed a Cortex®-M0+ 32-bit RISC core operating at up to 200 MHz frequency (16 MHz when running from backup regulator). This processor is located in the SmartRun domain, and can be used to ensure very-low-power peripheral activity when all other processors and domains are stopped.

STM32MP25xC/F devices can also embed a 3D graphic processing unit (VeriSilicon®, OpenGL ES 3.1, Vulkan 1.3, OpenCL 3.0, OpenVX 1.3) running at up to 900 MHz, with performances up to 150 Mtriangle/s, 900 Mpixel/s.

The graphic processing unit can provide a neural processor unit (VeriSilicon®, TensorFlowLite, ONNX, Linux NN) running at up to 900 MHz.

STM32MP25xC/F devices provide an external SDRAM interface supporting external memories up to 32‑Gbit density (4 Gbytes), 16- or 32-bit DDR3L up to 1066 MHz, 16- or 32-bit LPDDR4 or DDR4 up to 1200 MHz. The SDRAM content can be encrypted with AES-128.

The devices incorporate high-speed embedded memories: 808 Kbytes of internal SRAM (including 256-Kbyte AXI SYSRAM, 128-Kbyte AXI video SRAM (which can be used as general purpose), two banks of 128 Kbytes each of AHB SRAM, three banks of 8, 8, and 16 Kbytes of AHB SRAM in SmartRun domain, 128 Kbytes of AHB SRAM in backup domain, and 8 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix, and a 128/64-bit multi-layer AXI interconnect supporting access to internal and external memories.

Each device offers three ADCs, a low-power secure RTC, 12 general-purpose 16-bit timers, 4 general-purpose 32‑bit timers, three PWM timers for motor control, five low-power timers, and a true random number generator (RNG) , and cryptographic acceleration cells.

STM32MP25xC/F devices offer a video encoder and a video decoder.

The devices support 8 multi-function digital filters (MDF), and one dedicated audio-digital filter with sound-activity detection (ADF).

The devices feature the following standard and advanced communication interfaces.

Standard peripherals

  • eight I2Cs
  • four I3Cs
  • four USARTs and five UARTs
  • one low-power UART
  • eight SPIs, three I2Ss full-duplex master/slave. The I2S peripherals can be clocked via a dedicated internal audio PLL or via an external clock.
  • four SAI serial audio interfaces
  • one SPDIF Rx interface
  • three SDMMC interfaces
  • an USB 2.0 Host with embedded Hi-Speed PHY
  • an USB 2.0/3.0 dual-role data with both Hi-Speed and 5Gbits/s SuperSpeed PHYs
  • three FDCAN interfaces, including one supporting TTCAN mode (optional)
  • two Gigabit Ethernet Interface, with TSN support (optional)
  • one Gigabit Ethernet Switch connected to ETH1 and providing two external PHY interfaces, with TSN support (optional)

Advanced peripherals including

  • a flexible memory control (FMC) interface
  • two Octo-SPI flash memory interface , with on-the-fly content decryption
  • two camera interfaces for CMOS sensors, one with basic ISP, demosaicing and parallel or MIPI CSI interface
  • an LCD-TFT display interface
  • a MIPI DSI display interface (optional)
  • an LVDS display interface (optional)

A comprehensive set of power-saving mode allows the design of low-power applications.

STM32MP25xC/F devices are proposed in various packages up to 436 balls with 0.5 mm to 0.8 mm pitch. The set of included peripherals can change with the selected device.

These features make STM32MP25xC/F devices suitable for a wide range of consumer, industrial, white goods and medical applications.

  • All features

    • Includes ST state-of-the-art patented technology.
    • Cores
      • Up to 64-bit dual-core Arm® Cortex®-A35
        • Up to 1.5 GHz
        • 32-Kbyte I + 32-Kbyte D level 1 cache for each core
        • 512-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M33 with FPU/MPU
        • Up to 400 MHz
        • L1 16-Kbyte I / 16-Kbyte D
        • Arm® TrustZone®
      • 32-bit Arm® Cortex®-M0+ in SmartRun domain
        • Up to 200 MHz (up to 16 MHz in autonomous mode)
    • Memories
      • External DDR memory up to 4 Gbytes
        • Up to DDR3L-2133 16/32-bit
        • Up to DDR4-2400 16/32-bit
        • Up to LPDDR4-2400 16/32-bit
      • 808-Kbyte internal SRAM: 256-Kbyte AXI SYSRAM, 128-Kbyte AXI video RAM or SYSRAM extension, 256-Kbyte AHB SRAM, 128-Kbyte AHB SRAM with ECC in backup domain, 8-Kbyte SRAM with ECC in backup domain, 32 Kbytes in SmartRun domain
      • Two Octo-SPI memory interfaces
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs, and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, active tamper, environmental monitors, display secure layers, hardware accelerators
      • Complete resource isolation framework
    • Reset and power management
      • 1.71 to 1.95 V and 2.7/3.0 to 3.6 V multiple section I/O supply
      • POR, PDR, PVD, and BOR
      • On-chip LDO and power-switches for RETRAM, BKPSRAM, VSW, and SmartRun domains
      • Dedicated supplies for Cortex®-A35 and GPU/NPU (if present)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop, and Standby
      • DDR memory retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
    • Clock management
      • Internal oscillators: 64 MHz HSI, 4/16 MHz MSI, 32 kHz LSI
      • External oscillators: 16-48 MHz HSE, 32.768 kHz LSE
      • Up to 8× PLLs with fractional mode
    • General-purpose inputs/outputs
      • Up to 172 secure I/O ports with interrupt capability
        • Up to 6 wake-up inputs
        • Up to 8 tamper input pins + 8 active tampers output pins
    • Interconnect matrix
      • Bus matrices
        • 128-, 64-, 32-bit STNoC interconnect, up to 600 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 400 MHz
    • 4 DMA controllers to unload the CPU
      • 48 + 4 physical channels in total
      • 3× dual master port, high-performance, general-purpose, direct memory access controller (HPDMA), 16 channels each
      • 1× low-power DMA controller with 4 channels in SmartRun domain
    • Up to 51 communication peripherals
      • 8× I2C FM+ (1 Mbit/s, SMBus/PMBus®)
      • 4× I3C (12.5 Mbit/s)
      • 5× UART + 4× USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI) + 1× LPUART
      • 8× SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)(+2 with OCTOSPI + 4 with USART)
      • 4× SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • 3× SDMMC up to 8-bit (SD/e•MMC™/SDIO)
      • Up to 3× CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
      • 1× USB 2.0 high-speed Host with embedded 480 Mbits/s PHY
      • 1× USB 2.0/3.0 high-speed/SuperSpeed dual role data with embedded 480 Mbits/s and 5 Gbits/s PHY (5 Gbits/s PHY shared with PCI Express)
      • 1× USB Type-C® Power Delivery control with two CC lines PHY
      • 1 × PCI Express with embedded 5 Gbits/s PHY (PHY shared with USB 3.0 SuperSpeed)
      • Up to 3× Gigabit Ethernet interfaces
        • 1× Gigabit Ethernet GMAC with one PHY interface (optional)
        • 1× Gigabit Ethernet GMAC with one external PHY interface, optionally internally connected to one embedded Ethernet switch providing two external PHY interfaces
        • TSN, IEEE 1588v2 hardware, MII/RMII/RGMII
      • Camera interface #1 (5 Mpixels @30 fps)
        • MIPI CSI-2®, 2× data lanes up to 2.5 Gbit/s each
        • 8- to 16-bit parallel, up to 120 MHz
        • RGB, YUV, JPG, RawBayer with Lite-ISP
        • Lite-ISP, demosaicing, downscaling, cropping, 3 pixel pipelines
      • Camera interface #2 (1 Mpixels @15 fps)
        • 8- to 14-bit parallel, up to 80 MHz
        • RGB, YUV, JPG
        • Cropping
      • Digital parallel interface up to 16-bit input or output
    • 7 analog peripherals
      • 3 × ADCs with 12-bit max. resolution (up to 5 Msps each, up to 23 channels)
      • Internal temperature sensor (DTS)
      • 1× multifunction digital filter (MDF) with up to 8 channels/8 filters
      • 1× audio digital filter (ADF) with 1 filter and sound activity detection
      • Internal (VREFBUF) or external ADC reference VREF+
    • Graphics
      • Optional 3D GPU: VeriSilicon® - Up to 900 MHz
        • OpenGL® ES 3.1 - Vulkan 1.3
        • OpenCL™ 3.0, OpenVX™ 1.3
        • Up to 150 Mtriangle/s, 900 Mpixel/s
      • LCD-TFT controller, up to 24-bit // RGB888
        • Up to FHD (1920 × 1080) @60 fps
        • 3 layers including a secure layer
        • YUV support, 90° output rotation
      • Optional MIPI DSI®, 4× data lanes, up to 2.5 Gbit/s each
        • Up to QXGA (2048 × 1536) @60 fps
      • Optional FPD-1 and OpenLDI JEIDA/VESA (LVDS), up to 2× links of 4× data lanes, up to 1.1 Gbit/s per lane
        • Up to QXGA (2048 × 1536) @60 fps
    • Artificial intelligence
      • Optional NPU: VeriSilicon® - Up to 900 MHz
        • TensorFlowLite - ONNX - Linux NN
    • Video processing
      • Optional hardware video encoder and decoder up to 600 MHz
        • H264/VP8 up to FHD (1920×1080) @60 fps
        • JPEG up to 500 Mpixel/s
        • 128 Kbytes of video RAM
    • Up to 34 timers and 7 watchdogs
      • 4× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 3× 16-bit advanced motor control timers
      • 10× 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5× 16-bit low-power timers
      • Secure RTC with subsecond accuracy and hardware calendar
      • Up to 2× 4 Cortex®-A35 system timers (secure, non-secure, virtual, hypervisor)
      • 2× SysTick Cortex®-M33 timer (secure, non-secure)
      • 1× SysTick Cortex®-M0+ timer
      • 7× watchdogs (5× independent and 2× window)
    • Hardware acceleration
      • AES-128, -192, -256, DES/TDES
      • Secure AES-256 with SCA
      • RSA, ECC, ECDSA with SCA
      • HASH (SHA-1, SHA-224, SHA-256, SHA3), HMAC
      • True random number generator
      • CRC calculation unit
      • “On-the-fly” DDR encryption/decryption (AES-128)
      • “On-the-fly” OTFDEC Octo-SPI flash memory decryption (AES-128)
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
    • 12288-bit fuses including 96-bit unique ID
    • All packages are ECOPACK2 compliant

Circuit Diagram

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      STM32 MPU OpenSTLinux software package for X-STM32MP1-MSP01 expansion board

      STM32 MPU OpenSTLinux Expansion Packages ST
      X-LINUX-MSP1

      Description:

      STM32 MPU OpenSTLinux software package for X-STM32MP1-MSP01 expansion board

      X-LINUX-NFC5

      Active

      STM32 MPU OpenSTLinux software expansion package for RFAL-based NFC applications

      STM32 MPU OpenSTLinux Expansion Packages ST
      X-LINUX-NFC5

      Description:

      STM32 MPU OpenSTLinux software expansion package for RFAL-based NFC applications

      X-LINUX-NFC6

      Active

      STM32 MPU OpenSTLinux software expansion package for RFAL-based NFC applications

      STM32 MPU OpenSTLinux Expansion Packages ST
      X-LINUX-NFC6

      Description:

      STM32 MPU OpenSTLinux software expansion package for RFAL-based NFC applications

      X-LINUX-QT

      Active

      STM32 MPU OpenSTLinux Expansion Package for QT Framework

      STM32 MPU OpenSTLinux Expansion Packages ST
      X-LINUX-QT

      Description:

      STM32 MPU OpenSTLinux Expansion Package for QT Framework

      X-LINUX-RT

      Active

      X-LINUX-RT expansion package enables OpenSTLinux real-time extension

      STM32 MPU OpenSTLinux Expansion Packages ST
      X-LINUX-RT

      Description:

      X-LINUX-RT expansion package enables OpenSTLinux real-time extension
    • Part number
      Status
      Description
      Type
      Supplier

      STM32MP257F-DK

      Active

      Discovery kit with STM32MP257F MPU

      STM32 discovery kits ST
      STM32MP257F-DK

      Description:

      Discovery kit with STM32MP257F MPU

      STM32MP257F-EV1

      Active

      Evaluation board with STM32MP257F MPU

      STM32 eval boards ST
      STM32MP257F-EV1

      Description:

      Evaluation board with STM32MP257F MPU
    • Part number
      Status
      Description
      Type
      Supplier

      AC6 Trainings

      Active

      AC6 trainings related to ST products

      Training from partners AC6
      AC6 Trainings

      Description:

      AC6 trainings related to ST products

      Ac6-consulting

      Active

      Linux & Windows Engineering Services (OS, System, Expertise)

      Engineering services from partners AC6
      Ac6-consulting

      Description:

      Linux & Windows Engineering Services (OS, System, Expertise)

      Bootlin Embedded Linux Training

      Active

      Learn how to develop an embedded Linux system

      Training from partners Bootlin
      Bootlin Embedded Linux Training

      Description:

      Learn how to develop an embedded Linux system

      Crank Professional Services

      Active

      Engineering Services for embedded GUI development

      Engineering services from partners Crank AMETEK
      Crank Professional Services

      Description:

      Engineering Services for embedded GUI development

      Digi ConnectCore Cloud Services

      Active

      Digi ConnectCore Cloud Services empower OEMs to develop smart connected devices and maintain them after release with secure over-the-air (OTA) software updates

      Global services from partners Digi International
      Digi ConnectCore Cloud Services

      Description:

      Digi ConnectCore Cloud Services empower OEMs to develop smart connected devices and maintain them after release with secure over-the-air (OTA) software updates

      Digi ConnectCore Security Services

      Active

      Digi ConnectCore® Security Services analyze software running on ConnectCore SOMs for security risks and vulnerabilities during the entire product lifecycle and help remediate issues

      Global services from partners Digi International
      Digi ConnectCore Security Services

      Description:

      Digi ConnectCore® Security Services analyze software running on ConnectCore SOMs for security risks and vulnerabilities during the entire product lifecycle and help remediate issues

      Display and HMI customization services

      Active

      Display and HMI specialist services

      Engineering services from partners Martinsson Elektronik
      Display and HMI customization services

      Description:

      Display and HMI specialist services

      Embedded Wizard GUI Services: From Idea to Product

      Active

      Optional GUI Services for Embedded Wizard

      Engineering services from partners Embedded Wizard
      Embedded Wizard GUI Services: From Idea to Product

      Description:

      Optional GUI Services for Embedded Wizard

      GStreamer Consulting

      Active

      The premier, Open Source multimedia framework

      Engineering services from partners Collabora
      GStreamer Consulting

      Description:

      The premier, Open Source multimedia framework

      Linux Board Support Package Development

      Active

      Linux kernel and bootloader porting on your hardware

      Engineering services from partners Bootlin
      Linux Board Support Package Development

      Description:

      Linux kernel and bootloader porting on your hardware

      Savoir-Faire Linux Professional services

      Active

      Consulting, integration, development, training and IT support services

      Engineering services from partners Savoir-Faire Linux
      Savoir-Faire Linux Professional services

      Description:

      Consulting, integration, development, training and IT support services

      Savoir-Faire Linux Training on Buildroot for Linux applications

      Active

      Using Buildroot build system for industrial Linux applications

      Training from partners Savoir-Faire Linux
      Savoir-Faire Linux Training on Buildroot for Linux applications

      Description:

      Using Buildroot build system for industrial Linux applications

      Savoir-Faire Linux training to design a Yocto system for industrial applications

      Active

      Training on how to use Buildroot to design a Yocto System for industrial applications

      Training from partners Savoir-Faire Linux
      Savoir-Faire Linux training to design a Yocto system for industrial applications

      Description:

      Training on how to use Buildroot to design a Yocto System for industrial applications

      Support Services

      Active

      The Digi Support Services team of technical engineers and online resources help you gain the most from your Digi products

      Engineering services from partners Digi International
      Support Services

      Description:

      The Digi Support Services team of technical engineers and online resources help you gain the most from your Digi products

      Systerel Embedded Systems Development

      Active

      Embedded Systems Development Support

      Engineering services from partners Systerel
      Systerel Embedded Systems Development

      Description:

      Embedded Systems Development Support

      Technical support and consulting

      Active

      Embedded Linux Technical support and consulting

      Engineering services from partners Bootlin
      Technical support and consulting

      Description:

      Embedded Linux Technical support and consulting

      Trainings and workshops

      Active

      Technical trainings and workshops

      Training from partners DH electronics
      Trainings and workshops

      Description:

      Technical trainings and workshops

      Upstreaming Linux kernel, drivers and bootloader code

      Active

      Official open-source project management

      Engineering services from partners Bootlin
      Upstreaming Linux kernel, drivers and bootloader code

      Description:

      Official open-source project management

      White label design service

      Active

      One-stop-shop for white label customized HMI and Display Solutions

      Design services from partners Martinsson Elektronik
      White label design service

      Description:

      One-stop-shop for white label customized HMI and Display Solutions

      Wireless Design Services

      Active

      Digi Wireless Design Services (WDS) helps companies solve business problems by embedding wireless and wired technologies to create innovative products

      Design services from partners Digi International
      Wireless Design Services

      Description:

      Digi Wireless Design Services (WDS) helps companies solve business problems by embedding wireless and wired technologies to create innovative products

      Yocto Project and OpenEmbedded development training

      Active

      Yocto Project and OpenEmbedded development training

      Training from partners Bootlin
      Yocto Project and OpenEmbedded development training

      Description:

      Yocto Project and OpenEmbedded development training

      bytesatwork engineering services

      Active

      Hardware, Application and Embedded Linux development

      Engineering services from partners bytesatwork
      bytesatwork engineering services

      Description:

      Hardware, Application and Embedded Linux development

      eBUS SDK Training

      Active

      Online training programs to provide an in-depth Introduction to eBUS SDK and Advanced Developer for eBUS SDK courses

      Training from partners Pleora Technologies
      eBUS SDK Training

      Description:

      Online training programs to provide an in-depth Introduction to eBUS SDK and Advanced Developer for eBUS SDK courses
    • Part number
      Status
      Description
      Type
      Supplier

      ST-MCU-FINDER-PC

      Active

      STM32 and STM8 product finder for desktops

      STM32 utilities ST
      ST-MCU-FINDER-PC

      Description:

      STM32 and STM8 product finder for desktops

      STEDGEAI-DC

      Active

      ST Edge AI Developer Cloud - Free online platform to easily optimize and benchmark AI models across a variety of ST devices.

      Edge AI tools ST
      STEDGEAI-DC

      Description:

      ST Edge AI Developer Cloud - Free online platform to easily optimize and benchmark AI models across a variety of ST devices.

      STM32-ISP-IQTune

      Active

      Image Signal Processing (ISP) tuning tool for STM32 developers

      STM32 configurators and code generators --
      STM32-ISP-IQTune

      Description:

      Image Signal Processing (ISP) tuning tool for STM32 developers

      STM32CubeIDE

      Active

      Integrated Development Environment for STM32

      STM32 IDEs ST
      STM32CubeIDE

      Description:

      Integrated Development Environment for STM32

      STM32CubeMX

      Active

      STM32Cube initialization code generator

      STM32 configurators and code generators ST
      STM32CubeMX

      Description:

      STM32Cube initialization code generator

      STM32CubeMonitor

      Active

      Monitoring tool to test STM32 applications at run-time

      STM32 performance and debuggers ST
      STM32CubeMonitor

      Description:

      Monitoring tool to test STM32 applications at run-time

      STM32CubeProg

      Active

      STM32CubeProgrammer software for all STM32

      STM32 programmers ST
      STM32CubeProg

      Description:

      STM32CubeProgrammer software for all STM32

EDA Symbols, Footprints and 3D Models

STMicroelectronics - STM32MP255C

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Please select one model supplier :

Symbols

Symbols

Footprints

Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Longevity Commitment Longevity Starting Date Material Declaration**
STM32MP255CAI3
Active
TFBGA 436 18x18x1.2 P 0.8 mm Industrial Ecopack2 10 2025-01-01T00:00:00.000+01:00
STM32MP255CAJ3
Preview
TFBGA 361 16x16x1.2 P 0.8 mm Industrial Ecopack2 10 2025-01-01T00:00:00.000+01:00
STM32MP255CAK3
Active
VFBGA 424 14x14x1.0 P 0.5 mm Industrial Ecopack2 10 2025-01-01T00:00:00.000+01:00
STM32MP255CAK3T
Active
VFBGA 424 14x14x1.0 P 0.5 mm Industrial Ecopack2 10 2025-01-01T00:00:00.000+01:00
STM32MP255CAL3
Active
VFBGA 361 10x10X1.0 P 0.5 mm Industrial Ecopack2 10 2025-01-01T00:00:00.000+01:00

STM32MP255CAI3

Package:

TFBGA 436 18x18x1.2 P 0.8 mm

Material Declaration**:

Marketing Status

Active

Package

TFBGA 436 18x18x1.2 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP255CAJ3

Package:

TFBGA 361 16x16x1.2 P 0.8 mm

Material Declaration**:

PDF XML

Marketing Status

Preview

Package

TFBGA 361 16x16x1.2 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP255CAK3

Package:

VFBGA 424 14x14x1.0 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

VFBGA 424 14x14x1.0 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP255CAK3T

Package:

VFBGA 424 14x14x1.0 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

VFBGA 424 14x14x1.0 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP255CAL3

Package:

VFBGA 361 10x10X1.0 P 0.5 mm

Material Declaration**:

Marketing Status

Active

Package

VFBGA 361 10x10X1.0 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Part Number
Marketing Status
Budgetary Price (US$)*/Qty
Order from ST
Order from distributors
Package
Packing Type
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
Junction Temperature (°C) (min)
Junction Temperature (°C) (max)
STM32MP255CAK3T
Active
Available at distributors

Distributor availability of STM32MP255CAK3T

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
VFBGA 424 14x14x1.0 P 0.5 mm Tape and Reel TAIWAN 3A991.a.2 NEC -40 125
STM32MP255CAI3
Active
15.3 / 10k
Available at distributors

Distributor availability of STM32MP255CAI3

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
TFBGA 436 18x18x1.2 P 0.8 mm Tray TAIWAN 3A991.a.2 NEC -40 125
STM32MP255CAJ3
Preview
Available at distributors

Distributor availability of STM32MP255CAJ3

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
TFBGA 361 16x16x1.2 P 0.8 mm Tray TAIWAN 3A991.a.2 NEC -40 125
STM32MP255CAL3
Active
11.88 / 10k
Available at distributors

Distributor availability of STM32MP255CAL3

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
VFBGA 361 10x10X1.0 P 0.5 mm Tray TAIWAN 3A991.a.2 NEC -40 125
STM32MP255CAK3
Active
13.05 / 10k
Available at distributors

Distributor availability of STM32MP255CAK3

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
VFBGA 424 14x14x1.0 P 0.5 mm Tray TAIWAN 3A991.a.2 NEC -40 125

STM32MP255CAK3T Active

Budgetary Price (US$)*/Qty:
-
Package:
VFBGA 424 14x14x1.0 P 0.5 mm
Packing Type:
Tape and Reel
RoHS:
Country of Origin:
TAIWAN
ECCN (US):
3A991.a.2
ECCN (EU):
NEC

Part Number:

STM32MP255CAK3T

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

Distributor Name

Distributor reported inventory date:

STM32MP255CAI3 Active

Budgetary Price (US$)*/Qty:
15.3 / 10k
Package:
TFBGA 436 18x18x1.2 P 0.8 mm
Packing Type:
Tray
RoHS:
Country of Origin:
TAIWAN
ECCN (US):
3A991.a.2
ECCN (EU):
NEC

Part Number:

STM32MP255CAI3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

Distributor Name

Distributor reported inventory date:

STM32MP255CAJ3 Preview

Budgetary Price (US$)*/Qty:
-
Package:
TFBGA 361 16x16x1.2 P 0.8 mm
Packing Type:
Tray
RoHS:
Country of Origin:
TAIWAN
ECCN (US):
3A991.a.2
ECCN (EU):
NEC

Part Number:

STM32MP255CAJ3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

Distributor Name

Distributor reported inventory date:

STM32MP255CAL3 Active

Budgetary Price (US$)*/Qty:
11.88 / 10k
Package:
VFBGA 361 10x10X1.0 P 0.5 mm
Packing Type:
Tray
RoHS:
Country of Origin:
TAIWAN
ECCN (US):
3A991.a.2
ECCN (EU):
NEC

Part Number:

STM32MP255CAL3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

Distributor Name

Distributor reported inventory date:

STM32MP255CAK3 Active

Budgetary Price (US$)*/Qty:
13.05 / 10k
Package:
VFBGA 424 14x14x1.0 P 0.5 mm
Packing Type:
Tray
RoHS:
Country of Origin:
TAIWAN
ECCN (US):
3A991.a.2
ECCN (EU):
NEC

Part Number:

STM32MP255CAK3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

Distributor Name

Distributor reported inventory date:

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors